(재)경남테크노파크에서 수행 중인 「경남 반도체 부품·장비 기술개발사업」과 관련하여, 반도체 부품 및 
               장비 분야 기술개발이 가능한 기업을 아래와 같이 모집 공고하오니 많은 참여 바랍니다.


                     ❍   신청기간
                               -  패스트 트랙: 2024. 06. 24.(월) ~  2024. 06. 28.(금), 5일간
                               -  일반 트랙: 2024. 06. 24.(월) ~ 2024. 07. 08.(월), 15일간
                     ❍   지원대상 :    경남지역 소재 반도체산업 관련 중소·중견기업
                                                  -  경상남도 내에 사업장(본사, 공장, 연구소)을 1개 이상 보유한 기업으로 
                                                       공고일 기준 영업활동을 하는 법인 또는 개인사업자 
                     ❍   지원유형 및 규모 :  반도체 관련 기업의 반도체 부품·장비 분야 신제품 개발, 
                                                                품질향상 및 공정혁신 등 기술개발 지원 (4개사)
                                                               -  패스트 트랙 : 15백만원 (2개사)
                                                               -  일반 트랙 : 30백만원 (2개사)
                     ❍   신청방법 :    홈페이지 접수( http://www.gntp.or.kr ) 
                     ❍   문  의  처 :    경남테크노파크  나노융합본부 센서융합팀 
                                                   류아영 연구원( 055-326-7008 / yeong97@gntp.or.kr )
                     ❍   링        크 :     https://www.gntp.or.kr/biz/applyInfo/3180